• Unit-E launches mini DOS game console

            Just after Sony and Nintendo launched the classic replica version of the mini-game console, under the emotional support of Classic, the fans enthusiasti

    2019-01-27

  • PCB circuit board process

    The circuit board is divided into single panel, double panel, multi-layer PCB board, especially in the BGA package of the circuit board. The requirements for the via hole of the BGA package must be flat, the convex and concave are plus or minus 1 mil, and the edge of the via hole is not red tinned; Through-hole Tibetan tin beads, in order to meet customer requirements, the via hole plugging process can be described as various, the process is particularly long, the process control is difficult, often in the hot air leveling and green oil soldering resistance test oil drop; And so on.

    2019-01-15

  • MCU growth is strong and will hit a record high in 2022

    According to IC Insight, a well-known research institute, global sales fell by 6% in 2016 due to slower unit shipments of MCUs, but it is expected to record a record high annual revenue by 2022.After

    2019-01-10

  • Super easy to use ARM embedded system AI framework

    OPEN AI LAB was established in December 2016 and was initiated by ARM China United Industry Partner. It is committed to promoting deep cooperation in the entire industry chain of chips, hardware, algorithms and software, and accelerates the deployment of artificial intelligence industrial applications and the expansion of application scenarios. Tengine is a lightweight, modular, high-performance neural network inference engine optimized for ARM embedded devices. Perfect support for ARM platform, support for ARM Cortex CPU, ARM Mali GPU, ARM DLA, third-party DSP, is compatible with "Almighty King".

    2018-12-31

  • Microsoft Xbox One will be released next year

    As seen in the official Sony statement, they are preparing for something new, and the new thing may be the PS5 game console that the audience has been waiting for for a long time. Now Microsoft Xbox h

    2018-12-24

  • STM32WB Wireless IoT Integration Solution

    The STM32WB is the 12th mass-produced product released by STM32. The release date is also scheduled for October 12, 2018. More interestingly, this product release chose STM32's 10th anniversary celebration hotel. Such a clever design, such a touching story, such a shocking release, had to impress the guests and the media at the event. Cao Jindong, director of marketing and application of STMicroelectronics China's microcontroller business unit, still remembers nostalgia when he introduces the event. He recalls ST in the MCU market.

    2018-12-14

  • Silang Technology completed several hundred million financing

    Smart Logic announced that it has completed hundreds of millions of rounds of financing. The leading investor in this financing is Shanghai Lianhe Investment Co., Ltd. (referred to as “Lianhe Investme

    2018-12-08

  • Mass production of DDR5 memory chips by the end of 2019

    Although the DDR5 standard has not yet been finalized, Cadence and Micron have begun to develop 16Gb capacity DDR5 products and plan to mass production by the end of 2019.In fact, as early as May of t

    2018-12-07

Your SEO optimized title page contents